Material Options for RFI Shielding: Three Popular Metals

Not all EMI shields are built the same, which means that shields need to be custom constructed depending on the application and design of an electronic device. There are many considerations to make during the design process, including galvanic compatibility, budget, application environment, material thickness, and most importantly, material. The material option you choose for your devices plays a crucial role in how devices perform. Materials choice also affects the cost of shielding.

When thinking about material options, three types of metal are most used by electronic engineers. These three metals include:

Aluminum is a material that is ideal for a variety of applications because the metals boast non-ferrous properties. It is also known for its high conductivity ratings and its strength-to-weight ratio. Aluminum does also pose some fabrication challenges, such as oxidizing over time and poor solderability.

Copper is often considered the most reliable of all RFI shielding materials because it effectively attenuates electrical and magnetic waves. This material is often used in MRI facilities and other important computer equipment. This metal is costly when compared to the alternative shielding options.

RFI Shielding

Pre-Tin Plated Steel is an excellent low-cost solution when working with low frequencies in the kHz range. Tin plating offers exceptional levels of corrosion protection that protects against rusting. Plating tin also increases the solderable surface of the material.

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